FYELABS is a unique "innovation-as-a-service" (IaaS) company spun out of McMaster University and based in Hamilton, ON, Canada. Over the past three years, we've partnered with 150+ ambitious startups across five countries to deliver mission-critical product development and problem-solving services.
We're looking for a world-class electronics hardware guru to join our Hamilton office. In this role you will architect, design, and validate complex mixed-signal PCBs and custom ASIC (or FPGA-based) solutions for next-generation embedded systems. Remote work is not permitted.
Location:
In-person, Hamilton, Ontario, Canada
Responsibilities:
Lead end-to-end PCB development: schematic capture, multi-layer layout (high-speed digital, mixed-signal, power distribution), DFM/DFT reviews and Gerber/package generation.
Drive custom silicon design: RTL coding (Verilog/VHDL), synthesis, place-and-route, LVS/DRC sign-off, and tape-out coordination (or FPGA prototyping).
Develop embedded firmware in C/C++ (and Python scripts) for hardware bring-up, bootloader integration, and driver development.
Perform signal-integrity and power-integrity analysis; collaborate with our simulation team on SI/PI tool flows.
Prototype, debug, and validate designs in lab: oscilloscope, logic analyzer, spectrum analyzer, BERT, boundary-scan, environmental/EMC testing.
Generate comprehensive documentation: BOMs, stack-up reports, test plans, and compliance dossiers.
Interface with component vendors and contract manufacturers to optimize cost, lead-time, and yield.
Mentor junior engineers and contribute to continuous improvement of our hardware development processes.
Qualifications:
Bachelor's or Master's in Electronics Engineering, Electrical Engineering, Computer Engineering, or Computer Science with a
solid electronics focus.
4+ years professional experience in PCB design, including high-speed digital and mixed-signal boards.
1+ years ASIC (or FPGA) design experience: RTL, synthesis, P&R, DRC/LVS.
Proficiency with EDA toolchains
Strong command of embedded firmware development in C/C++ and scripting in Python and micropython.
Deep understanding of SI/PI fundamentals, EMI/EMC mitigation, and thermal management.
Hands-on lab skills: oscilloscope, logic analyzer, boundary-scan, power supplies, and environmental chambers.
Excellent analytical, problem-solving, and communication skills.
Self-driven, able to work effectively with minimal supervision in a fast-paced environment.
Desired Skills & Attributes:
Extreme expertise in analog circuit design:
precision op-amp architectures, ultra-low-noise LDOs and switching regulators, high-performance PLLs, and high-resolution ADC/DAC interface networks.
Deep mastery in RF & wireless circuit design:
BLE/802.15.4 transceiver design, impedance matching, antenna layout and measurement, RF front-end filtering, and EMI mitigation.
Proven experience in audio driver circuits & DSP systems:
Class-D/AB amplifier design, codec interfacing, real-time DSP algorithm implementation for audio processing (e.g., filtering, EQ, echo cancellation).
Experience with RTOS (FreeRTOS, ThreadX) and bare-metal bring-up.
Prior involvement in ISO/IEC compliance, CE/FCC/UL certification processes.
Track record of delivering tape-outs or production FPGA images.
Portfolio of open-source hardware projects or published designs is a plus.
Interview Requirements:
PDF resume (no Word docs) with working email, phone number, and link to your GitHub/portfolio.
Be prepared to whiteboard a mixed-signal schematic and to develop a short Verilog/C coding exercise.
Candidates without an active online portfolio showcasing hardware designs will not be considered.
Company events and team outings
Dental, vision, and extended health coverage
Experience:
PCB Design: 4 years or more
ASIC/FPGA Design: 1 years or more
RTL Coding (Verilog/VHDL): 3 years or more
Embedded C/C++ Firmware: 4 years or more
Python Scripting: 2 years or more
Signal Integrity & Power Integrity: 2 years or more
We thank all who apply; however, only those selected for an interview will be contacted.