Job Description

Thermal Engineer - Front-End I/O Active Thermal Solutions

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Position Overview

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We are seeking a highly motivated Thermal Engineer to join our Front-End I/O Active Thermal Solutions team. This role is responsible for developing and optimizing active thermal management solutions for high-speed interconnect systems. The ideal candidate will collaborate closely with customers to define boundary conditions, perform thermal simulations, validate designs through lab testing, and deliver optimized, production-ready thermal solutions that meet performance, reliability, and manufacturability requirements.

Key Responsibilities

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Customer Collaboration Engage directly with customers to gather thermal boundary conditions, system-level constraints, and performance requirements. Translate customer needs into actionable simulation and test plans. Thermal Simulation and Analysis Develop and execute thermal models using CFD tools (e.g., ANSYS Icepak, FloTHERM, or equivalent). Analyze airflow, temperature distribution, and heat dissipation for active thermal solutions in high-density front-end I/O environments. Perform sensitivity and optimization studies to ensure thermal performance meets design goals. Experimental Validation Work with lab teams to plan and conduct thermal testing and validation. Correlate experimental data with simulation results to refine and validate models. Identify and troubleshoot thermal design issues through root-cause analysis and iterative testing. Optimization and Reporting Optimize designs based on simulation and test results to balance performance, cost, and manufacturability. Prepare detailed technical reports summarizing analysis, findings, and recommendations. Present results and optimized solutions to customers and cross-functional teams.

Qualifications

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Education & Experience:

Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or a related field. 3+ years of experience in thermal design or analysis for electronic systems or interconnect hardware preferred.


Technical Skills:

Proficiency with CFD tools (ANSYS Icepak, FloTHERM, or equivalent). Experience with thermal instrumentation and data acquisition (thermocouples, IR cameras, etc.). Familiarity with CAD software (SolidWorks, Creo, or similar). Strong understanding of heat transfer, fluid dynamics, and electronic packaging.


Soft Skills:

Excellent problem-solving and analytical skills. Strong communication and presentation abilities for customer interaction and reporting. Ability to manage multiple projects in a fast-paced environment.

Preferred Qualifications

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Experience developing thermal solutions for high-speed connectors, modules, or front-panel I/O systems. Background in active cooling technologies (fans, blowers, heat pipes, vapor chambers, etc.). Understanding of electrical and mechanical design trade-offs in system integration. Experience with Design of Experiments (DOE) or statistical optimization methods.

Why Join Us

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Work on cutting-edge interconnect technologies driving next-generation data centers and high-performance computing. Collaborate with multidisciplinary teams in a global engineering environment. * Opportunity to innovate and directly influence customer product performance and reliability.