Job Description

locations
Canada - Ottawa (Bill Leathem)
time type
Full time
posted on
Posted Yesterday
job requisition id
20251600
It's fun to work in a company where people truly BELIEVE in what they're doing!

We're committed to bringing passion and customer focus to the business. If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Lumentum Canada was awarded the 2022 National Capital Region's Top Employers for the 6th consecutive year and the 2022 Career Directory Canada's Best Employers for Recent Graduates for the 5th consecutive year.

What You'll Be DoingDesign the opto-mechanical elements of next-generation optical products for telecom, data centers, and AI/ML infrastructure, from concept to completion, in collaboration with cross-functional teams. Ensure designs meet opto-mechanical, thermal performance, reliability, time-to-market, and cost requirements Lead concept design evaluations and define the optimal design architecture in collaboration with simulation, optical, design authority, tooling, hardware/electrical, and process teams Conduct design reviews, focusing on design for manufacturability (DfM), engineering analysis to predict product performance and reliability, design optimization, material selection, dimensional stability of optics, and tolerance analysis Engage with suppliers to explore new technologies and materials for opto-mechanical packaging and advanced semiconductor packaging, including flip chips, 2.5D/3D advanced packaging, silicon photonics, adhesives/epoxies/underfills, ceramics, thermal interface materials, hermetic packaging technologies, and thermoelectric coolers Perform FEA to evaluate stress, warpage, solder joint reliability in advanced electronics packaging assemblies Simulate/quantify linear/nonlinear material behaviors of BGA solder joints, copper pillars, underfills in terms of plasticity/viscoelasticity, creep, etc. Drive design of experiments (DOEs) to guide design decisions and process improvements, covering chip warpage, stress-optics, dimensional stability of optics, shock and vibration, and thermal performance Document design files, best practices, and internal design guidelines to ensure knowledge retention and continuous improvement

What We're Looking For
Minimum qualifications:BS in Mechanical Engineering or equivalent Experience in opto-mechanical design with working knowledge of mechanical design related to optical performance, thermal performance, shock and vibration, aging, process and manufacturability Experience in mechanical design and simulation of advanced semiconductor packages such as flip chips, 2.5D/3D advanced packaging Experience in design, simulation and testing of thermal solutions for advanced opto-electronics packages and systems including air-cooling and liquid-cooling solutions. Proven working knowledge of GD&T standards, metrology, statistical tolerances and how they relate to process and design variations in high volume manufacturing Proficiency in using 3D CAD software to work on large assemblies in PLM environment Self-motivated, action-focused, and results-oriented individual with strong negotiation skills to collaborate with other functional teams, taking a technical leadership role Detail-oriented with a strong sense of ownership and commitment to end-to-end project execution Positive attitude and a team player, with the ability to work effectively with different stakeholders in a cross-functional environment Desire and capability to learn quickly, continuously improve, and adapt to dynamic challenges Ability to drive technical negotiations while balancing performance, time-to-market and cost considerations

Desired qualifications:Proven experience addressing complex mechanical and thermal design challenges in products for Co-Packaged Optics (CPO) applications Experience in designing products for shock and vibration requirements according to Telcordia standard Experience in telecom/datacom photonics product development and manufacturing including silicon photonics technology Working knowledge of reliability qualification of semiconductor packages and design-for-reliability (DfR) and industry standards such as IPC, JEDEC, etc. Knowledge of material science and behavior of materials including brittle, ductile materials, viscoelastic materials such as adhesives/epoxies, TIMs Working knowledge of opto-mechanical STOP (Structural Thermal Optical Performance) analysis and experimental validation (FEA/CFD, design of experiment for model calibration, materials characterization DOE, etc.) Previous experience with Structural, Thermal, Analysis & Results (STAR) module in Ansys Familiar with optical metrology instruments such as optical interferometry, polarimeter, etc. and testing and post-processing data analysis 5-10+ years of experience on opto-mechanical design of optical systems

Experience in SolidWorks and Solid Edge