Overview:
Rambus, a premier chip and silicon IP provider, is seeking a bright and motivated internship (co-op) student in either an Engineering or Computer Science program for a 4 month or 8 month work term within the Firmware Engineering team in the Memory Interface Chips Business Unit. The student will work alongside some of the brightest inventors and engineers in the world to develop firmware and software solutions that make data faster and safer.
During the internship, the student will join a Firmware Engineering team to work on cutting edge memory and silicon technology shaping the future of data centers and high-performance systems. The student will develop, test, and debug software for memory diagnostic applications and embedded CPUs in System-On-Chips (SoCs). The student will gain experience with processor-memory interfaces, DDR5, BIOS, Redfish, OpenBMC, as well as other third-party SW stacks. The student should have a strong interest in embedded software development and electronics, and be a self-starter with strong organizational, communication, teamwork, and debugging skills.
Rambus offers a flexible work environment, embracing a hybrid approach for the majority of our office-based roles. We encourage employees to spend an average of at least three days per week working onsite, allowing for two days of remote work.
Responsibilities:
Design, implement, test, and debug software for embedded devices and systems, from requirements to deployment.
Write unit tests and feature tests for test automation.
Setup, maintain, and debug systems used for DDR5 memory diagnostic development.
Follow coding convention and best practices of the team, and conduct code reviews.
Qualifications:
C/C++ programming skills.
Ability to follow technical guidance from senior team members.
Excellent written and verbal communication skills.
Desired Skills:Previous embedded software courses and / or projects.
One or more previous co-op terms, preferably with embedded development experience.
Python scripting skills
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